A simple and residual-layer-free solute–solvent separation soft lithography method
Author:
Publisher
IOP Publishing
Subject
Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Link
http://stacks.iop.org/0960-1317/25/i=9/a=095013/pdf
Reference22 articles.
1. SOFT LITHOGRAPHY
2. Imprint of sub‐25 nm vias and trenches in polymers
3. Deformation of nanostructures on polymer molds during soft UV nanoimprint lithography
4. Features of gold having micrometer to centimeter dimensions can be formed through a combination of stamping with an elastomeric stamp and an alkanethiol ‘‘ink’’ followed by chemical etching
5. Fabrication of three-dimensional micro-structures: Microtransfer molding
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4. Residual layer assisted demolding in roll-to-roll UV imprint lithography;Microelectronic Engineering;2019-09
5. Characterization of Mechanical Properties of 3-D–Printed Materials Using the Asymmetric Four-Point Bending Test and Virtual Fields Method;Journal of Testing and Evaluation;2019-05-09
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