Effect of Solder Joint Width to the Mechanical Aspect in Thermal Stress Analysis

Abstract

Abstract The solder joint has a different dimension which depends on the component or package size. The thermal induced stress, strain and displacement is difficult to visualize due to small size during the component assembly process. Thus, this study is aimed to investigate those mechanical aspects via thermal stress analysis using finite element method. A model of surface mount capacitor was created in the simulation software. The influence of the different widths to the stress, strain and displacement were investigated. The simulation results revealed that the solder width significantly affects the stress, strain and displacement of the solder joint. The increment of the width decreases the strain and stress of the solder joint. The lowest stress and strain were found on the 3.1 mm of solder joint. Thus, the simulation results are expected to provide the understanding of mechanical aspects of solder joint in the thermal stress analysis.