Sn-Pb and lead free solders containing active carbon particles
Author:
Publisher
IOP Publishing
Subject
General Medicine
Link
http://stacks.iop.org/1757-899X/146/i=1/a=012043/pdf
Reference14 articles.
1. Adsorption of phenolic compounds by activated carbon—a critical review
2. Fundamentals of the theory of adsorption in micropores of carbon adsorbents: characteristics of their adsorption properties and microporous structures
3. Influence of thermal aging on microhardness and microstructure of Sn–0.3Ag–0.7Cu–xIn lead-free solders
4. Evolution of Ag3Sn at Sn–3.0Ag–0.3Cu–0.05Cr/Cu joint interfaces during thermal aging
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. The Microstructural, Mechanical and Electrical Properties of Pb-Sn and Lead-Free SC0.7 Solders Containing Sub Micron Active Carbon Particles;Journal of Polytechnic;2023-08-15
2. Effects of alloying elements on the dissolution and diffusion of Bi in Sn: A first-principles study;IOP Conference Series: Earth and Environmental Science;2021-02-01
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