Effect of Zinc Additions on Sn-0.7Cu-0.05Ni Lead-Free Solder Alloy
Author:
Publisher
IOP Publishing
Subject
General Medicine
Link
http://stacks.iop.org/1757-899X/238/i=1/a=012012/pdf
Reference25 articles.
1. Intermetallic Compound Formation on Solder Alloy/Cu-Substrate Interface Using Lead-Free Sn-0.7Cu/Recycled-Aluminum Composite Solder
2. Research Advances of Composite Solder Material Fabricated via Powder Metallurgy Route
3. The Effect of Micron-Size Silicon Additions on Microstructure, Microhardness and Thermal Properties of Sn-Cu-Ni Solder Alloy
4. Non-Metal Reinforced Lead-Free Composite Solder Fabrication Methods and its Reinforcing Effects to the Suppression of Intermetallic Formation: Short Review
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1. Microstructure, hardness, electrical, and thermal conductivity of SZCN solder reinforced with TiO2 and ZrO2 nanoparticles fabricated by powder metallurgy method;Journal of Materials Science: Materials in Electronics;2024-06
2. Effect of Isothermal Aging on Mechanical Properties of Sn–0.7Cu–xZn Lead-Free Solder;Springer Proceedings in Physics;2023
3. Effect of Al Addition to the Solidification and Microstructure Formation on Sn–Ag–Cu Solder Alloy;Springer Proceedings in Physics;2023
4. Effect of Ni on the Suppression of Sn Whisker Formation in Sn-0.7Cu Solder Joint;Materials;2021-02-05
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