Simulation of defect zones in scribed silicon wafers
Author:
Publisher
IOP Publishing
Subject
General Medicine
Link
http://stacks.iop.org/1757-899X/15/i=1/a=012046/pdf
Reference9 articles.
1. Stress analysis of 3-dimensional IC package as function of structural design parameters
2. Dicing of MEMS Devices
3. Investigations of the influence of dicing techniques on the strength properties of thin silicon
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