Optimization of entrapping conditions to improve the release of BMP-2 from PELA carriers by response surface methodology
Author:
Publisher
IOP Publishing
Subject
Biomedical Engineering,Biomaterials,Bioengineering
Link
https://iopscience.iop.org/article/10.1088/1748-6041/10/1/015002/pdf
Reference32 articles.
1. Tissue Engineering: Orthopedic Applications
2. Development of PEG–PLA/PLGA microparticles for pulmonary drug delivery prepared by a novel emulsification technique assisted with amphiphilic block copolymers
3. Combining technologies to create bioactive hybrid scaffolds for bone tissue engineering
4. Injectable and thermo-sensitive PEG-PCL-PEG copolymer/collagen/n-HA hydrogel composite for guided bone regeneration
Cited by 14 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Optimisation of microencapsulation efficiency of propolis phenolic compounds by double emulsion method using response surface methodology;Acta Alimentaria;2024-03-11
2. Effect of miR-222 on the Angiogenesis of Bone Microvascular Endothelial Cells After Repair of Vascular Endothelial Growth Factor with Polylactide-Poly(ethylene glycol)-Polylactide (PELA) Microspheres;Journal of Biomaterials and Tissue Engineering;2022-12-01
3. Poly(Lactic Acid)-Based Microparticles for Drug Delivery Applications: An Overview of Recent Advances;Pharmaceutics;2022-02-04
4. Deployment of response surface methodology to optimize microencapsulation of peroxidases from turnip roots ( Brassica rapa L.) by double emulsion in PLA polymer;Journal of Food Science;2021-04-25
5. Development of FGF-2-loaded electrospun waterborne polyurethane fibrous membranes for bone regeneration;Regenerative Biomaterials;2020-10-04
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3