Abstract
Abstract
AlGaN/GaN high electron mobility transistors (HEMTs) with different device sizes were prepared and exposed to 0.4 MeV proton irradiation. The low-field carrier transport characteristics of the gate channel are obtained from the capacitance-voltage curves and current-voltage curves. For the device with a longer gate-drain distance (30 μm), after 0.4 MeV proton irradiation, the gate-channel low-field carrier mobility increases by 14.3% on average. For the device with a shorter gate-drain distance (15 μm), the carrier mobility decreases by 13.4% on average after proton irradiation. This phenomenon is studied with regard to the polarization scattering effect. It is found that the polarization distribution in the AlGaN/GaN HEMTs changes after proton irradiation and different gate-drain distances correspond to different polarization distributions.
Funder
National Natural Science Foundation of China
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials