A Novel Method for Creating a Glass Insulation Layer on the Copper Antenna Surface

Abstract

Abstract A method of generating glass insulation on copper antenna surfaces under low-temperature conditions was developed and validated. The method is not only capable of firing insulation layers on copper surfaces at temperatures below 1000 °C but is also suitable for both curved copper wires and flat copper sheets. In this method, a silicon dioxide (SiO2) based powder is mixed with water at a certain specific gravity to prepare a low-temperature glaze. The oxygen-free copper is polished, annealed, and pickled before being impregnated and glazed. After the glaze on the surface of the oxygen-free copper has dried, the sintering is carried out in an argon atmosphere. The resulting glass insulation layer has a high bond strength to the copper surface and few impurities. The present results are expected to provide useful attempts and examples of solving the problem of inter-turn insulation and sputtering on copper antenna surfaces, and they show the broad application prospects of this method.