Effect of 60% thickness reduction of Sn-Cu solder alloy on localized micromechanical properties via nanoindentation approach

Abstract

Abstract The relationship between a process and mechanical properties are important in understanding the behaviour of a material under certain conditions. This indicate that mechanical properties of the materials can be modified through certain processing. Hence, this paper investigates the effect of 60% thickness reduction of Sn-Cu alloy in thermomechanical treatment on the localized micromechanical properties. A bar-shape of Sn-Cu solder alloy is subjected to heat treatment at 30°C, 60°C, 90°C, 120°C and 150°C for 20 minutes, followed by 60% thickness reduction via compression process. Sample without compression process was used as control sample. Nanoindentation approach was used to characterize the localized micromechanical properties of the samples. The results show the hardness value for control samples reduced approximately 56%, from 181 MPa at 30°C to 79 MPa at 150°C. Reduced modulus of control sample has shown similar decreasing trend from 149 GPa at 30°C to 85 GPa at 150°C, approximately 43% changes. Lower changes in hardness and reduced modulus observed for thermomechanical treated sample approximately 20% and 18%, respectively. These findings show that thermomechanical treatment has given significant effect on the localized micromechanical properties of Sn-Cu solder alloy.