In-process control of ground surface quality related to thermal distribution between diamond grain and workpiece
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy
Link
https://iopscience.iop.org/article/10.1088/1742-6596/2044/1/012191/pdf
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3. Dry micro-grooving on Si wafer using a coarse diamond grinding;Xie;International Journal of Machine Tools & Manufacture,2012
4. 3D graphical evaluation of micron-scale protrusion topography of diamond grinding wheel;Xie;International Journal of Machine Tools & Manufacture,2008
5. Experiment and numerical simulation study on laser truing and dressing of bronze-bonded diamond wheel;Chen;Optics and Lasers in Engineering,2010
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