Dry micro-grooving on Si wafer using a coarse diamond grinding

Author:

Xie J.,Xie H.F.,Liu X.R.,Tan T.W.

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering

Reference12 articles.

1. Uniform groove-depths in (110) Si anisotropic etching by ultrasonic waves and application to accelerometer fabrication;Ohwada;Sensors and Actuators A: Physical,1995

2. Optical reflectance reduction of textured silicon surfaces coated with an antireflective thin film;Edward;Thin Solid Films,1996

3. Fabrication of a micro needle for a trace blood test;Oka;Sensors and Actuators A: Physical,2002

4. Miniature 250μm thick fuel cell with monoithically fabricated silicon electrodes;Hayase;Electrochemical and Solid-State Letters,2004

5. Fiber misalignment in silicon V-groove based optical modules;Priyadarshi;Optical Fiber Technology,2006

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