Thermal Oxidation of Tungsten Coatings for Detection by Infrared Spectrometry Method

Abstract

Abstract Physical vapor deposition (PVD) of metallic thin films is used extensively in the fabrication of semiconductor technology devices - use as of lately for them have grown. Tungsten (W) is a low resistivity, refractory metal, that is often deposited by PVD methods for use as a gate contact to semiconductor devices and due to the low work function and high thermal stability, W can be used for the fabrication of field emitters in microelectronics [1-3]. In order to monitor quality of the synthesized thin films by magnetron sputtering method, it is necessary to develop methodology suitable for the analysis of these thin films. Infrared spectrometry is a sensitive method for the analysis of chemical bonds, but W thin films contain weakly polar and non-polar W-W bonds, that cannot be directly detected by infrared spectrometry, therefore oxidation of W is selected as thermal oxidation method for detecting oxidized products for thin films of thickness 150 nm, for instance, W-O bonds. After oxidation, it was observed, that the oxidation of W thin films takes place already at a 600 °C in the air atmosphere. The Fourier transform infrared spectrometry (FTIR) spectra of modified coatings showed formation of additional new signals in the region of 700-900 cm−1 attributed to W-O, O-W-O, W=O bonds - formation of W-oxygen bonds on Si-SiO2 substrate was achieved. For coating homogeneity and production quality formation, additionally synthesized control samples are recommended for FTIR analysis.