Analysis of Scanning Acoustic Microscopy Problems for Plastic Encapsulated Microcircuits with Complex Structure

Abstract

Abstract In order to keep up with the development trend of plastic encapsulated technology and effectively improve the Scanning Acoustic Microscopy (SAM) capability of Plastic Encapsulated Microcircuits (PEMs) with complex structure, the structural characteristics of complex packaging devices, the limitations of ultrasonic technology and the applicability of testing standards are systematically studied. The influence of complex package structure and chip coated structure on SAM detection is analysed. The influence of the limitation of ultrasonic technology on the thickness and number of layers of PEMs is studied. Finally, the applicability of SAM test standards is discussed. Through the research, many problems in the SAM detection of PEMs with complex structures are pointed out, and some test requirements and suggestions on test standards are given.