Interfacial Stress Analysis of PVD Thin Film Sensor Based on Finite Element

Abstract

Abstract The ability to monitor fractures is based on the integration of PVD thin film sensors and substrates, and the interface stress distribution of the sensor under load which directly impacts the bonding performance. This research analyzes the impact of film elastic modulus and thickness on film-substrate interface stress using the Abaqus software to investigate the influence of PVD film sensor material properties on the film/substrate interface stress distribution. The higher the concentration of interfacial tension, the thicker the layer. The sensor's structural parameters were optimized and significantly enhanced crack detecting sensitivity. The results reveal that the PVD film sensor material can detect structural defects efficiently. The conclusions established in this work have some implications for the optimal design of PVD thin film sensors.