Arbitrary substrate voltage wave forms for manipulating energy distribution of bombarding ions during plasma processing
Author:
Publisher
IOP Publishing
Subject
Condensed Matter Physics
Reference21 articles.
1. Highly selective SiO2/Si reactive ion beam etching withlow energy fluorocarbon ions
2. Ion bombardment energy and SiO2/Si fluorocarbon plasma etch selectivity
3. Ion bombardment energy control for selective fluorocarbon plasma etching of organosilicate glass
4. Effect of bias voltage waveform on ion energy distribution
5. Effect of nonsinusoidal bias waveforms on ion energy distributions and fluorocarbon plasma etch selectivity
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