Author:
Barbero M,Fritzsch T,Gonella L,Hügging F,Krüger H,Rothermund M,Wermes N
Subject
Mathematical Physics,Instrumentation
Cited by
9 articles.
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1. Characterisation of the HEXITEC4S X-ray spectroscopic imaging detector incorporating through-silicon via (TSV) technology;Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment;2022-02
2. A review of advances in pixel detectors for experiments with high rate and radiation;Reports on Progress in Physics;2018-05-29
3. Development of a Four-Side Buttable X-Ray Detection Module With Low Dead Area Using the UFXC32k Chips With TSVs;IEEE Transactions on Nuclear Science;2017-08
4. Results on 3D interconnection from AIDA WP3;Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment;2016-09
5. Status and perspectives of pixel sensors based on 3D vertical integration;Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment;2014-11