High resolution 3D imaging of bump-bonds by means of synchrotron radiation computed laminography-Reference-Cited by-同舟云学术

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High resolution 3D imaging of bump-bonds by means of synchrotron radiation computed laminography

Published:2013-12-19 Issue:12 Volume:8 Page:C12029-C12029
ISSN:1748-0221
Container-title:Journal of Instrumentation
language:
Short-container-title:J. Inst.

Author:

Cecilia A,Hamann E,Koenig T,Xu F,Cheng Y,Helfen L,Ruat M,Scheel M,Zuber M,Baumbach T,Fauler A,Fiederle M

Publisher

IOP Publishing

Subject

Mathematical Physics,Instrumentation

Link

http://stacks.iop.org/1748-0221/8/i=12/a=C12029/pdf

Reference16 articles.

1. Experimental comparison of pixel detector arrays and CCD-based systems for X-ray area detection on synchrotron beamlines

2. Photon-counting X-ray imaging at kilohertz frame rates

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. 3D high resolution imaging for microelectronics: A multi-technique survey on copper pillars;Ultramicroscopy;2018-10

2. Study of electromigration-induced formation of discrete voids in flip-chip solder joints by in-situ 3D laminography observation and finite-element modeling;Acta Materialia;2016-09

3. Sparse-view computed laminography with a spherical sinusoidal scan for nondestructive testing;Optics Express;2014-07-14

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