Investigation of low temperature bonding process using indium bumps
Author:
Publisher
IOP Publishing
Subject
Mathematical Physics,Instrumentation
Link
http://stacks.iop.org/1748-0221/13/i=11/a=C11007/pdf
Reference5 articles.
1. Development of an Indium bump bond process for silicon pixel detectors at PSI
2. TSV last for hybrid pixel detectors: Application to particle physics and imaging experiments
3. Timepix, a 65k programmable pixel readout chip for arrival time, energy and/or photon counting measurements
4. Low-temperature bump bonding of Timepix readout chips and CdTe sensors at Different Sensor pitches
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