The calculation of temperature distribution in punch-through structures during pulsed operation using the transmission line modelling (TLM) method
Author:
Publisher
IOP Publishing
Subject
Surfaces, Coatings and Films,Acoustics and Ultrasonics,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Link
http://stacks.iop.org/0022-3727/15/i=10/a=017/pdf
Reference17 articles.
1. Transient temperature rise in silicon semiconductor devices
2. A simple explicit and unconditionally stable numerical routine for the solution of the diffusion equation
3. Design concepts of high energy punchthrough structures
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1. Transmission line matrix (TLM) modeling of self-heating in power PIN diodes;Microelectronics Journal;2018-09
2. Efficient 3D-TLM Modeling and Simulation for the Thermal Management of Microwave AlGaN/GaN HEMT Used in High Power Amplifiers SSPA;Journal of Low Power Electronics and Applications;2018-06-23
3. Modeling Thermal Radiation Effects in Nanowires Using the TLM Method;IEEE Transactions on Nanotechnology;2013-11
4. Transmission-line-matrix (TLM) modeling of self-heating in AlGaN/GaN transistor structures;Microelectronics Journal;2008-10
5. TLM models of bending transients and their application to the deformation of thin walled ceramic shapes;International Journal of Numerical Modelling: Electronic Networks, Devices and Fields;2002
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