A Multi-Scale Study on Silicon-Oxide Etching Processes in C4F8/Ar Plasmas
Author:
Publisher
IOP Publishing
Subject
Condensed Matter Physics
Link
http://stacks.iop.org/1009-0630/18/i=6/a=666/pdf
Reference34 articles.
1. Plasma etching: Yesterday, today, and tomorrow
2. Optical and electrical diagnostics of fluorocarbon plasma etching processes
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4. Etching yields of SiO2by low energy CFx+and F+ions
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1. Etching of Ga2O3: an important process for device manufacturing;Journal of Physics D: Applied Physics;2024-09-12
2. Rate optimization of atomic layer etching process of silicon;Acta Physica Sinica;2023
3. Study on atomic layer etching of Si in inductively coupled Ar/Cl2plasmas driven by tailored bias waveforms;Plasma Science and Technology;2017-06-20
4. Multiscale Modeling of Low Pressure Plasma Etching Processes: Linking the Operating Parameters of the Plasma Reactor with Surface Roughness Evolution;Plasma Processes and Polymers;2016-10-28
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