Effect of C:F Deposition on Etching of SiCOH Low-kFilms in CHF360 MHz/2 MHz Dual-Frequency Capacitively Coupled Plasma
Author:
Publisher
IOP Publishing
Subject
Condensed Matter Physics
Reference12 articles.
1. Low-k dielectric materials
2. Low dielectric constant materials for microelectronics
3. Plasma enhanced chemical vapor deposited SiCOH dielectrics: from low-kto extreme low-kinterconnect materials
4. Developments of Plasma Etching Technology for Fabricating Semiconductor Devices
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4. On treatment of ultra-low-k SiCOH in CF4 plasmas: correlation between the concentration of etching products and etching rate;Applied Physics B;2015-03-07
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