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Copper–micrometer-sized diamond nanostructured composites

Published:2011-12-01 Issue: Volume:T145 Page:014069
ISSN:0031-8949
Container-title:Physica Scripta
language:
Short-container-title:Phys. Scr.

Author:

Nunes D,Livramento V,Shohoji N,Fernandes H,Silva C,Correia J B,Carvalho P A

Publisher

IOP Publishing

Subject

Condensed Matter Physics,Mathematical Physics,Atomic and Molecular Physics, and Optics

Link

http://stacks.iop.org/1402-4896/2011/i=T145/a=014069/pdf

Reference19 articles.

1. Proposal for a new technique to join CFC composites to copper

2. Overview of fusion nuclear technology in Europe

3. Thermal properties of diamond/copper composite material

4. Theory of the thermal expansion of Si and diamond

5. The Thermal Expansion of Pure Metals: Copper, Gold, Aluminum, Nickel, and Iron

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Mechanical and Thermal Properties of Pulsed Electric Current Sintered (PECS) Cu-Diamond Compacts;Metallurgical and Materials Transactions B;2013-06-12

2. Multiscale Copper-µDiamond Nanostructured Composites;Materials Science Forum;2012-11

3. Tungsten–nanodiamond composite powders produced by ball milling;Journal of Nuclear Materials;2012-07

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