Effect of Fungus, Aspergillus sp. F1-1, on the Corrosion Behavior of PCB-HASL in Humid Atmospheric Environment

Abstract

Abstract Fungi, as one of the serious factors causing microbiologically influenced corrosion (MIC), can shorten the service life of electronic materials which are wildly used in the atmospheric environment. In this study, the effect of Aspergillus sp. F1-1 (A. F1-1) isolated from PCB samples after the exposure test in Xishuang Banna on the corrosion behavior of PCB-HASL was investigated. The presence of the A. F1-1 posed a threat of local corrosion on PCB-HASLs. An obvious decrease of pH was observed in PCB with A. F1-1 due to the various organic acids secreted by A. F1-1. The presence of the fungi also led to serious surface cracking and delamination. Creep corrosion and micro-hole corrosion were accelerated in the presence of A. F1-1 compared to the control. Additionally, the metabolic activities of A. F1-1 were associated with enrichment of Cu-containing corrosion products under the hypha.