Effects of annealing temperature on the electrical property and microstructure of aluminum contact on n-type 3C—SiC
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy
Link
https://iopscience.iop.org/article/10.1088/1674-1056/23/6/066803/pdf
Reference29 articles.
1. A critical review of ohmic and rectifying contacts for silicon carbide
2. Large‐band‐gap SiC, III‐V nitride, and II‐VI ZnSe‐based semiconductor device technologies
3. Status of silicon carbide (SiC) as a wide-bandgap semiconductor for high-temperature applications: A review
4. Study of runaway electron behaviour during electron cyclotron resonance heating in the HL-2A Tokamak
5. Formation of low resistivity ohmic contacts to n-type 3C-SiC
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Electrical Property Study of Ni/Nb Contact to n-Type 4H-SiC;Materials Science Forum;2018-06
2. Low contact resistivity between Ni/Au and p-GaN through thin heavily Mg-doped p-GaN and p-InGaN compound contact layer;Chinese Physics B;2015-11
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