Thermal stability and electrical properties of copper nitride with In or Ti
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy
Link
http://stacks.iop.org/1674-1056/22/i=6/a=066804/pdf
Reference29 articles.
1. Cu3N Thin Film for a New Light Recording Media
2. Copper nitride and tin nitride thin films for write‐once optical recording media
3. Growth and properties of Cu3N films and Cu3N/γ′-Fe4N bilayers
4. Thermal decomposition of copper nitride thin films and dots formation by electron beam writing
5. Intrinsic surface band bending inCu3N(100)ultrathin films
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