Thermal decomposition of copper nitride thin films and dots formation by electron beam writing-Reference-Cited by-同舟云学术

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Thermal decomposition of copper nitride thin films and dots formation by electron beam writing

Published:2001-01 Issue: Volume:169-170 Page:358-361
ISSN:0169-4332
Container-title:Applied Surface Science
language:en
Short-container-title:Applied Surface Science

Author:

Nosaka Toshikazu,Yoshitake Masaaki,Okamoto Akio,Ogawa Soichi,Nakayama Yoshikazu

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference9 articles.

1. Cu3N Thin Film for a New Light Recording Media

2. Copper nitride and tin nitride thin films for write‐once optical recording media

3. Covalent Nitrides for Maskless Laser Writing of Microscopic Metal Lines

4. Copper nitride thin films prepared by reactive radio-frequency magnetron sputtering

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3. Preparation of Cu3N thin films by nitridation of solution process-derived thin films using urea;Journal of Sol-Gel Science and Technology;2021-12-01

4. Oxidation behavior of copper nitride thin films deposited by direct current magnetron sputtering;Journal of Materials Science: Materials in Electronics;2021-10-19

5. The influence of thermal stability on the properties of Cu3N layers synthesized by pulsed magnetron sputtering method;Thin Solid Films;2021-10

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