Time-resolved study of the electron temperature and number density of argon metastable atoms in argon-based dielectric barrier discharges
Author:
Funder
Natural Sciences and Engineering Research Council of Canada
Publisher
IOP Publishing
Subject
Condensed Matter Physics
Link
http://iopscience.iop.org/article/10.1088/1361-6595/aaa5d9/pdf
Reference41 articles.
1. Characterization of argon dielectric barrier discharges applied to ethyl lactate plasma polymerization
2. Plasma‐Enhanced Chemical Vapor Deposition of Silicon Dioxide Deposited at Low Temperatures
3. Characteristics of Silicon Dioxide Films on Patterned Substrates Prepared by Atmospheric‐Pressure Chemical Vapor Deposition Using Tetraethoxysilane and Ozone
4. Atmospheric Pressure Low Temperature Direct Plasma Technology: Status and Challenges for Thin Film Deposition
5. Feasibility of Antireflection and Passivation Coatings by Atmospheric Pressure PECVD
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