Curing monitoring of bonded composite patch at constant temperature with electromechanical impedance and system parameters evaluation approach

Abstract

Abstract As one of cost-effective maintenance methods, bonded composite patch repair has been receiving more and more attention in the engineering community since past decades. However, realizing real-time monitoring for curing process of bonded repair patch is difficult for most current techniques. In our work, a method based on electromechanical impedance and system parameters evaluation for structural health monitoring issues was developed, which could implement the online monitoring throughout whole curing process. Compared with the dynamic thermomechanical analysis results, the experiment data matches well. It demonstrates that the proposed approach can effectively monitor the curing process of composite repair patch at a constant temperature of 120 °C. Hence, the presented approach in this paper is expected to be a novel, robust, and real-time monitoring method for structural maintenance with the composite patch.