Optimization study on magnetorheological fluid components and process parameters of cluster magnetorheological finishing with dynamic magnetic field for sapphire substrates

Abstract

Abstract Sapphire is used as the base material of high-brightness LED devices, high-speed and high-frequency wireless communication devices, and solar photovoltaic conversion chips. Its surface quality determines the performance of the device. Magnetorheological (MR) finishing can avoid scratches and surface/subsurface damage caused by uneven abrasive particles due to the viscoelasticity of the polishing pad. When MR polishing was used to polish sapphire substrates, the adaptability of the MR fluid components and the rationality of polishing process was the key to quickly obtain high-quality workpiece surface. In this study, sapphire substrates were polished using cluster MR finishing with dynamic magnetic fields formed by multiple synchronous rotation magnetic poles. The components of the MR fluid were optimized by single-factor experiments, and the polishing process parameters were optimized through orthogonal experiment. The results showed that an ultra-smooth surface of Ra 0.27 nm could be obtained when sapphire substrate was polished 8 h by using the optimized MR fluid, which contained 120 nm silica sol with a mass fraction of 8 wt% and W3 carbonyl iron powders with a mass fraction of 16 wt%, also with the optimized process parameters as the machining gap, the workpiece speed, the magnetic pole speed and the rotation speed of the polishing disc were 1 mm, 350 r min−1, 45 r min−1 and 40 r min−1, respectively.