A LEED study of Cu(111) (1 × 1)-Ni using reliability (R) factors
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,General Engineering,Condensed Matter Physics
Link
http://stacks.iop.org/0022-3719/15/i=26/a=028/pdf
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1. The interplay between geometry, electronic structure, and reactivity of Cu-Ni bimetallic (111) surfaces;Applied Physics A: Materials Science & Processing;2003-03-01
2. The growth of thin Cu layers on Ni(111) studied by CO titration and photoelectron spectroscopy;Surface Science;2000-05
3. THE ORIENTATION OF BENZENE ON BIMETALLIC SURFACES;Surface Review and Letters;1999-10
4. Growth and morphology of Ni films on Cu(111);Surface Science;1998-01
5. Manipulation of growth modes in heteroepitaxy: Ni/Cu(111);Applied Physics Letters;1996-12-02
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