Effects of temperature and grain size on diffusivity of aluminium: electromigration experiment and molecular dynamic simulation

Author:

Cui ZhenORCID,Zhang YaqianORCID,Hu Dong,Vollebregt StenORCID,Fan Jiajie,Fan Xuejun,Zhang GuoqiORCID

Abstract

Abstract Understanding the atomic diffusion features in metallic material is significant to explain the diffusion-controlled physical processes. In this paper, using electromigration experiments and molecular dynamic (MD) simulations, we investigate the effects of grain size and temperature on the self-diffusion of polycrystalline aluminium (Al). The mass transport due to electromigration are accelerated by increasing temperature and decreasing grain size. Magnitudes of effective diffusivity (D eff) and grain boundary diffusivity (D GBs) are experimentally determined, in which the D eff changes as a function of grain size and temperature, but D GBs is independent of the grain size, only affected by the temperature. Moreover, MD simulations of atomic diffusion in polycrystalline Al demonstrate those observations from experiments. Based on MD results, the Arrhenius equation of D GBs and empirical formula of the thickness of grain boundaries at various temperatures are obtained. In total, D eff and D GBs obtained in the present study agree with literature results, and a comprehensive result of diffusivities related to the grain size is presented.

Publisher

IOP Publishing

Subject

Condensed Matter Physics,General Materials Science

Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Coupling model of electromigration and experimental verification – Part II: Impact of thermomigration;Journal of the Mechanics and Physics of Solids;2023-05

2. Effect of Thermomigration on Electromigration in SWEAT Structures;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17

3. Implementation of Fully Coupled Electromigration Theory in COMSOL;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

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