A novel circle center location method for a large-scale wafer
Author:
Funder
National Natural Science Foundation of China
Publisher
IOP Publishing
Subject
Applied Mathematics,Instrumentation,Engineering (miscellaneous)
Link
https://iopscience.iop.org/article/10.1088/1361-6501/abfc85/pdf
Reference38 articles.
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2. Polycrystalline silicon wafer defect segmentation based on deep convolutional neural networks;Han;Pattern Recognit. Lett.,2020
3. Minimum circumscribed circle and maximum inscribed circle of roundness deviation evaluation with intersecting chord method;Liu;IEEE Trans. Instrum. Meas.,2016
4. Bayesian approach for circle fitting including prior knowledge;Keksel;Surf. Topogr. Metrol. Prop.,2018
5. Development of laser-vision system for three-dimensional circle detection and radius measurement;Lee;Optik,2015
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