Multi-LED package design, fabrication and thermal analysis-Reference-Cited by-同舟云学术

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Multi-LED package design, fabrication and thermal analysis

Published:2013-05 Issue:5 Volume:34 Page:054002
ISSN:1674-4926
Container-title:Journal of Semiconductors
language:
Short-container-title:J. Semicond.

Author:

Poelma R. H.,Tarashioon S.,van Zeijl H. W.,Goldbach S.,Zijl J. L. J.,Zhang G. Q.

Publisher

IOP Publishing

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://stacks.iop.org/1674-4926/34/i=5/a=054002/pdf

Reference8 articles.

1. High-Brightness GaN-Based Light-Emitting Diodes on Si Using Wafer Bonding Technology

2. Thermal analysis and optimization of multiple LED packaging based on a general analytical solution

3. Effect of the joule heating on the quantum efficiency and choice of thermal conditions for high-power blue InGaN/GaN LEDs

4. High-efficiency diode lasers at high output power

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