Thermal analysis and optimization of multiple LED packaging based on a general analytical solution-Reference-Cited by-同舟云学术

Thermal analysis and optimization of multiple LED packaging based on a general analytical solution

Published:2010-01 Issue:1 Volume:49 Page:196-201
ISSN:1290-0729
Container-title:International Journal of Thermal Sciences
language:en
Short-container-title:International Journal of Thermal Sciences

Author:

Cheng Ting,Luo Xiaobing,Huang Suyi,Liu Sheng

Publisher

Elsevier BV

Subject

General Engineering,Condensed Matter Physics

Reference22 articles.

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5. S. Lee, S. Song, V. Au, K.P. Moran, Constriction/spreading resistance model for electronics packaging, in: Proceedings of ASME/JSME Thermal Engineering Conference, vol. 4, 1995, pp. 199–206.

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