Coupled stress-diffusion modelling of grain boundary segregation and dynamic embrittlement in a copper alloy
Author:
Publisher
IOP Publishing
Subject
Computer Science Applications,Mechanics of Materials,Condensed Matter Physics,General Materials Science,Modelling and Simulation
Link
http://iopscience.iop.org/article/10.1088/1361-651X/ab1624/pdf
Reference26 articles.
1. Modelling of hydrogen diffusion and hydrogen induced cracking in supermartensitic and duplex stainless steels
2. Influence of hydrogen coverage on the parameters of a cohesive zone model dedicated to fatigue crack propagation
3. Dynamic embrittlement at intermediate temperature in a Cu–Ni–Si alloy
4. Grain-boundary modelling of hydrogen assisted intergranular stress corrosion cracking
5. Modelling of stress-corrosion cracking by using peridynamics
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