Fabrication of homogenous multilayered W films by multi-step sputtering deposition: a novel grain boundary enrichment strategy-Reference-Cited by-同舟云学术

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Fabrication of homogenous multilayered W films by multi-step sputtering deposition: a novel grain boundary enrichment strategy

Published:2015-10-12 Issue:44 Volume:26 Page:445603
ISSN:0957-4484
Container-title:Nanotechnology
language:
Short-container-title:Nanotechnology

Author:

Zhu Hailin,Yang Jijun,Wan Qiang,Lin Liwei,Liao Jiali,Yang Yuanyou,Liu Ning

Funder

National Natural Science Foundation of China

Publisher

IOP Publishing

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,General Materials Science,General Chemistry,Bioengineering

Link

http://stacks.iop.org/0957-4484/26/i=44/a=445603/pdf

Reference47 articles.

1. Resistivity of thin Cu films coated with Ta, Ti, Ru, Al, and Pd barrier layers from first principles

2. Pulse current electrodeposition of tungsten coatings on V–4Cr–4Ti alloy

3. The origin of stress in sputter-deposited tungsten films for x-ray masks

4. Efficient Annealing of Radiation Damage Near Grain Boundaries via Interstitial Emission

5. Helium bubble formation in ultrafine and nanocrystalline tungsten under different extreme conditions

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1. Surface roughness analysis of Cu seed layer deposited on α-Ti diffusion barrier layer: A molecular dynamics simulation study;Journal of Applied Physics;2024-02-05

2. Surface roughness analysis of Cu films deposited on Si substrates: A molecular dynamic analysis;Journal of Applied Physics;2019-07-28

3. Preparation, structure, and properties of high-entropy alloy multilayer coatings for nuclear fuel cladding: A case study of AlCrMoNbZr/(AlCrMoNbZr)N;Journal of Nuclear Materials;2018-12

4. Modeling the micro-scale static friction coefficient of the MEMS silicon surfaces affected by Ag and Au deposition using the thermal evaporation method;Journal of Adhesion Science and Technology;2018-11-19

5. Effect of deposition parameters on surface roughness and consequent electromagnetic performance of capacitive RF MEMS switches: a review;Journal of Micromechanics and Microengineering;2017-10-16

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