Comprehensive investigation of sequential plasma activated Si/Si bonded interfaces for nano-integration on the wafer scale-Reference-Cited by-同舟云学术

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Comprehensive investigation of sequential plasma activated Si/Si bonded interfaces for nano-integration on the wafer scale

Published:2010-03-08 Issue:13 Volume:21 Page:134011
ISSN:0957-4484
Container-title:Nanotechnology
language:
Short-container-title:Nanotechnology

Author:

Kibria M G,Zhang F,Lee T H,Kim M J,Howlader M M R

Publisher

IOP Publishing

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,General Materials Science,General Chemistry,Bioengineering

Link

http://stacks.iop.org/0957-4484/21/i=13/a=134011/pdf

Reference42 articles.

1. Nanopackaging

2. Wafer Direct Bonding: From Advanced Substrate Engineering to Future Applications in Micro/Nanoelectronics

3. Nanotube micro-opto-mechanical systems

4. Electrothermal Bonding of Carbon Nanotubes to Glass

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