Ultra-low temperature anodic bonding of silicon and glass based on nano-gap dielectric barrier discharge
Author:
Publisher
Springer Science and Business Media LLC
Subject
Metals and Alloys,General Engineering
Link
http://link.springer.com/content/pdf/10.1007/s11771-021-4607-z.pdf
Reference28 articles.
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4. LEIB J, GYENGE O, HANSEN U, MAUS S, HAUCK K, ZOSCHKE K, TOEPPER M. Wafer-level glass-caps for advanced optical applications [C]// Proceedings Electronic Components & Technology Conference. Lake Buena Vista, FL: IEEE, 2012: 1642–1648. DOI: https://doi.org/10.1109/ECTC.2011.5898732.
5. DASCHNER R, KÜBLER H, LÖW R, BAUR H, FRÜHAUF N, PFAU T. Triple stack glass-to-glass anodic bonding for optogalvanic spectroscopy cells with electrical feedthroughs [J]. Applied Physics Letters, 2014, 105(4). DOI: https://doi.org/10.1063/1.4891534.
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