Microstructure and properties of Sn-3.8Ag-0.7Cu-xCe lead-free solders with liquid-liquid structure transition and Ce addition-Reference-Cited by-同舟云学术

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Microstructure and properties of Sn-3.8Ag-0.7Cu-xCe lead-free solders with liquid-liquid structure transition and Ce addition

Published:2019-10-23 Issue:11 Volume:6 Page:1165b8
ISSN:2053-1591
Container-title:Materials Research Express
language:
Short-container-title:Mater. Res. Express

Author:

Xiaoguang Liu,Xiaoming Jiang,Lichao Cao^ORCID,Wengang Zhai,Xianfen Li,Zhou Wei

Funder

Guangdong Province Science and Technology Project

the high-level leading talent introduction program of GDAS

GuangZhou Science and Technology Project

Publisher

IOP Publishing

Subject

Metals and Alloys,Polymers and Plastics,Surfaces, Coatings and Films,Biomaterials,Electronic, Optical and Magnetic Materials

Link

http://iopscience.iop.org/article/10.1088/2053-1591/ab4d3a/pdf

Reference30 articles.

1. The effect of various thermal treatments on supercooling of PbTe melts

2. Effect of melt overheating, cooling and solidification rates on Al–16wt.%Si alloy structure

3. Grain refinement of Al–Si alloy (A356) by melt thermal treatment

4. Optimizing microstructures and mechanical properties of hypereutectic Al-18%Si alloy via manipulating its parent liquid state

5. Different solidification behaviours of Bi–10wt%Te alloy induced by liquid structural change

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Heredity of preferred orientation of β-Sn grains in Cu/SAC305/Cu micro solder joints;Journal of Alloys and Compounds;2021-07

2. Strategies for inducing heredity of β-Sn texture in micro solder joints during multi-reflow process;Materials & Design;2021-06

3. Liquid-liquid structure transition in metallic melt and its impact on solidification: A review;T NONFERR METAL SOC;2020

4. Failure Analysis of SAC305 Ball Grid Array Solder Joint at Extremely Cryogenic Temperature;Applied Sciences;2020-03-12

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