Fabrication of Through Micro-hole Arrays in Silicon Using Femtosecond Laser Irradiation and Selective Chemical Etching
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy
Link
https://iopscience.iop.org/article/10.1088/0256-307X/32/10/107901/pdf
Reference22 articles.
1. Through-Silicon Via (TSV)
2. Silicon-micromachined microchannel plates
3. Progress on the development of silicon microchannel plates
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1. Array structure of monocrystalline silicon surface processed by femtosecond laser machining assisted with anisotropic chemical etching;Optics & Laser Technology;2024-02
2. Optimization of the femtosecond laser trepan drilling strategy on IN792 for improving hole geometrical characteristics and machining efficiency;The International Journal of Advanced Manufacturing Technology;2023-05-09
3. Fabrication of microgrooves in PMN-PT using femtosecond laser irradiation and acid etching;Applied Optics;2022-07-15
4. Application of Femtosecond Laser Irradiation and Wet Etching in Fabrication of Microstructures in Crystal Materials;Laser & Optoelectronics Progress;2020
5. Fabrication of Taper Free Micro-Holes Utilizing a Combined Rotating Helical Electrode and Short Voltage Pulse by ECM;Micromachines;2019-01-03
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