Effects of hydromagnetic and chemical reaction over a stagnation point flow of horizontal stretching/shrinking cylinder in Ag-CuO/water hybrid nanofluid

Author:

Aladdin Nur Adilah Liyana,Bachok Norfifah

Abstract

Purpose This paper aims to explore on stagnation point flow of Ag-CuO/water over a horizontal stretching/shrinking cylinder by adding the effect of chemical reaction, B together with the magnetic field, M. Design/methodology/approach A set of reduced ordinary differential equations from the governing equations of partial differential equations is obtained through similarities requirements. The resulting equations are solved using bvp4c in MATLAB2019a. The impact of various physical parameters such as curvature parameter, ϒ, chemical reaction rate, B, magnetic field, M and Schmidt numbers, Sc on shear stress, f0 local heat flux, -θ(0) and mass transfer, -(0) also for velocity, f(η), temperature, θ(η) and concentration, ∅(η) profiles have been plotted and briefly discussed. In this work, some vital characteristics such as local skin friction, Cf, local Nusselt number, Nux and local Sherwood number, Shx are chosen for physical and numerical analysis. Findings The findings expose that the duality of solutions appears in a shrinking region ( ε < 0). The value of skin friction, heat transfer rate and mass transfer rate reduction for existing of M, but in contrary result obtain for larger ϒ, B and Sc. Furthermore, the hybrid nanofluid demonstrates better heat transfer compared to nanofluid. Practical implications The hybrid nanofluid has widened its applications such as in electronic cooling, manufacturing, automotive, heat exchanger, solar energy, heat pipes and biomedical, as their efficiency in the heat transfer field is better compared to nanofluid. Originality/value The findings on stagnation point flow of Ag-CuO/water over a horizontal stretching/shrinking cylinder with the effect of chemical reaction, B and magnetic field, M is new and the originality is preserved for the benefits of future researchers.

Publisher

Emerald

Subject

Applied Mathematics,Computer Science Applications,Mechanical Engineering,Mechanics of Materials

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