Double diffusive MHD squeezing copper water nanofluid flow between parallel plates filled with porous medium and chemical reaction

Author:

T. Chandrapushpam,Bhuvaneswari M.,Sivanandam Sivasankaran

Abstract

Purpose This paper aims to explore the double diffusive magneto-hydrodynamic (MHD) squeezed flow of (Cu–water) nanofluid between two analogous plates filled with Darcy porous material in existence of chemical reaction and external magnetic field. Design/methodology/approach The governing nonlinear equations are transformed into ordinary differential equations by means of similarity transforms, and the coupled mass and heat transference equations are resolved analytically with the application of differential transform method (DTM). The effects of different relevant parameters on velocity, temperature and concentration, including the squeeze number, magnetic parameter, Biot number, Darcy number and chemical reaction parameter, are illustrated with figures. In addition, for various parameters, the local skin friction coefficient, local Nusselt number and local Sherwood number are computed and are graphically displayed. Findings It is observed that the squeeze number has a direct relationship with Sherwood number and an inverse relationship with skin friction as Biot number increases. With enhanced Biot numbers, the temperature value increases during both squeeze and non-squeeze moments, but the temperature values are higher for squeeze moments compared to the other case. Practical implications This research has potential applications in various large-scale enterprises that might benefit from increased productivity. Social implications The results are useful to thermal science community. Originality/value Unique and valuable insights are provided by studying the impact of chemical reaction on double diffusive MHD squeezing copper–water nanofluid flow between parallel plates filled with porous medium. In addition, this research has potential applications in various large-scale enterprises that might benefit from increased productivity.

Publisher

Emerald

Subject

Mechanical Engineering,Aerospace Engineering,Computational Mechanics,Engineering (miscellaneous)

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