Water Absorption in Glass Fibre‐Epoxide Resin Laminates

Author:

Smith C.A.

Abstract

Water absorption is a serious problem in all polymeric materials, including the glass fibre‐epoxide resin laminates used in printed circuit board manufacture. This paper describes experiments to determine the level of water absorption in these materials under different conditions of relative humidity and temperature using thermogravimetric analysis.

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering

Cited by 8 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. The detrimental effects of water on electronic devices;e-Prime - Advances in Electrical Engineering, Electronics and Energy;2021

2. Experimental Study of Moisture Ingress in First and Second Levels of Electronic Housings;IEEE Transactions on Components, Packaging and Manufacturing Technology;2018-11

3. Investigation of moisture uptake into printed circuit board laminate and solder mask materials;Journal of Materials Science: Materials in Electronics;2017-01-05

4. Moisture uptake and resulting mechanical response of bio-based composites. II. composites;Polymer Composites;2014-04-29

5. Dielectric properties of highly filled thermoplastics for printed circuit boards;Journal of Applied Polymer Science;2012-10-10

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