Experimental Study of Moisture Ingress in First and Second Levels of Electronic Housings-Reference-Cited by-同舟云学术

Experimental Study of Moisture Ingress in First and Second Levels of Electronic Housings

Published:2018-11 Issue:11 Volume:8 Page:1928-1937
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Conseil-Gudla Helene^ORCID,Hamm Gerald,Muller Lutz,Hain Mathias^ORCID,Ambat Rajan

Funder

Robert Bosch

ICCI Project funded by the Danish Council for Independent Research, Technology, and Production

IN-SPE project

Innovation Fund Denmark

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

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