Subject
Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science
Cited by
8 articles.
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1. Fan-In Technology;Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology;2024
2. State of the Art of Lead-Free Solder Joint Reliability;Journal of Electronic Packaging;2020-09-03
3. Design for Reliability of Solder Joints;Assembly and Reliability of Lead-Free Solder Joints;2020
4. Solder Joints in PCB Assembly and Semiconductor Packaging;Assembly and Reliability of Lead-Free Solder Joints;2020
5. Degradation of Contacts and Package Interconnections;Reliability and Failure of Electronic Materials and Devices;2015