Observations on the Growth and Impact of Intermetallic Compounds on Tin‐Coated Substrates
Author:
Publisher
Emerald
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering
Reference9 articles.
1. Solders, Solderable Finishes and Reflowed Solder Coatings
2. The Growth of Intermetallic Compounds on Common Basis Materials Coated with Tin and Tin-Lead Alloys
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