Growth kinetics of Cu–Sn intermetallic compounds at the interface of a Cu substrate and 42Sn–58Bi electrodeposits, and the influence of the intermetallic compounds on the shear resistance of solder joints-Reference-Cited by-同舟云学术

Growth kinetics of Cu–Sn intermetallic compounds at the interface of a Cu substrate and 42Sn–58Bi electrodeposits, and the influence of the intermetallic compounds on the shear resistance of solder joints

Published:2008-07 Issue:1 Volume:110 Page:95-99
ISSN:0254-0584
Container-title:Materials Chemistry and Physics
language:en
Short-container-title:Materials Chemistry and Physics

Author:

Suh Min-Suk,Park Chan-Jin,Kwon Hyuk-Sang

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Materials Science

Reference28 articles.

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3. Lead-free Alloy Plating Method, Patent report, Metal Finish. 100 (2002) 120.

4. Pb-free Component Finishes;Shetty,2000

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