New non‐reinforced substrates for use as embedded capacitors-Reference-Cited by-同舟云学术

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New non‐reinforced substrates for use as embedded capacitors

Published:2004-03 Issue:1 Volume:30 Page:36-41
ISSN:0305-6120
Container-title:Circuit World
language:en
Short-container-title:Circuit World

Author:

Andresakis John,Yamamoto Takuya,Biunno Nick

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering

Reference3 articles.

1. Gotro, J. and Kamla, J. (1999), “An improved laminate for embedded capacitance application”, IPC proceedings.

2. Novak, I. (2000), “Embedded passive electrical characterization results”, IPC Proceedings.

3. Yamamoto, T., Yamazaki, K. and Kuwako, F. (2002), “Next generation embedded capacitance material”, ECWC Proceedings.

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Accelerated Temperature and Voltage Stress Tests of Embedded Planar Capacitors With Epoxy–BaTiO3 Composite Dielectric;Journal of Electronic Packaging;2012-06-01

2. Embedded Capacitors in Printed Wiring Board: A Technological Review;Journal of Electronic Materials;2012-04-07

3. Dielectric behavior of three phase polyimide percolative nanocomposites;Journal of Applied Polymer Science;2006

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