Accelerated Temperature and Voltage Stress Tests of Embedded Planar Capacitors With Epoxy–BaTiO3 Composite Dielectric

Author:

Alam Mohammed A.1,Azarian Michael H.1,Osterman Michael1,Pecht Michael1

Affiliation:

1. Center for Advanced Life Cycle Engineering (CALCE), University of Maryland, College Park, MD 20742

Abstract

Accelerated temperature and voltage stress tests were conducted on embedded planar capacitors with epoxy–BaTiO3 composite dielectric. The failure modes were found to be a sudden increase in the leakage current across the capacitor dielectric and a gradual decrease in the capacitance. The failure mechanisms associated with these failure modes were investigated by performing data analysis and failure analysis. The time-to-failure as a result of a sudden increase in the leakage current was modeled using the Prokopowicz equation. The values of constants of the Prokopowicz equation, n and Ea, were determined for the epoxy–BaTiO3 composite. The degradation in capacitance was modeled by performing regression analysis. The time-to-failure and degradation models can be used for the qualification tests of embedded planar capacitors, for the development of new composite dielectric materials, and to improve the manufacturing processes of these capacitors.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Reference48 articles.

1. Material Characterization of High Dielectric Constant Polymer-Ceramic Composite for Embedded Capacitor to RF Application;Rao;Act. Passive Electron. Compon.

2. Effectiveness of Embedded Capacitors in Reducing the Number of Surface Mount Capacitors for Decoupling Applications;Alam;Circuit World

3. Testing of Passive Elements Embedded in PCB Using Impedance Spectroscopy;Piasecki

4. Chosen Electrical and Stability Properties of Passive Components Embedded in Printed Circuit Boards;Dziedzic;Electr. Rev.

5. Operational Performances Demonstration of Polymer-Ceramic Embedded Capacitors for MMIC Applications;Majek;IEEE Trans. Compon., Packag., Manuf. Technol.

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