Thin‐film embedded resistor and capacitor technologies

Author:

Chinoy Percy,Langlois Marc

Abstract

Printed circuit board designers face formidable challenges of increased functionality in smaller size boards, and reduced EMI in high‐speed circuits. Embedded passives technology can open up valuable space on the board surface while also improving the electrical performance and reliability of high density, high‐speed designs. Shipley has developed a thin‐film, high sheet resistivity (1,000 Ω/□) resistor material sold under the trade name InSite™ in response to this market need. This paper describes the manufacturing process for embedded resistors and discusses measured data on resistance values, uniformity, and thermal effects, and their impact on design rules for resistor size. Preliminary results of Shipley's thin‐film embedded capacitor technology with high capacitance densities (10 and 200 nF/cm2) are also presented.

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering

Reference5 articles.

1. Chinoy, P. and Hariharan, R. (2003), “Thermal and ESD characteristics of high ohmic value embedded resistors”, Proceedings of IPC Embedded Passives Conference, June 2003, Northbrook, Illinois.

2. Chinoy, P. and Langlois, M. (2003), “InSite™ embedded resistor and capacitor technologies”, Proceedings of IPC Expo, March 2003, Long Beach.

3. Chinoy, P., Langlois, M. and Schemenaur, J. (2002), “High ohmic value embedded resistor material”, Circuitree.

4. Funer, R. (2002), “Embedding resistors and capacitors”, Printed Circuit Design.

5. Ridler, T., Mac Neill, J., Hariharan, R. and Chinoy, P. (2002), “InSite™ high ohmic value embedded resistor material”, Proceedings of ECWC Symposium, October 2002, Cologne.

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